Engineering Ceramic Substrates
for High-Power Semiconductor Packaging
AlN · Si₃N₄ · Al₂O₃ DPC · DBC · AMB
Applications
Ceramic substrate solutions for thermal management, electrical isolation and metallization reliability in demanding semiconductor packaging environment
Laser Diode Packaging
AlN DPC substrates for laser diode packages, laser heat sinks and optical modules requiring fast heat dissipation, fine copper circuitry and stable insulation.
Recommended:
AlN · DPC
GaN Power Electronics
Ceramic substrates for compact GaN power devices where high thermal conductivity, electrical isolation and reliable copper metallization are critical to package performance.
Recommended:
AlN · DPC / DBC
SiC Power Modules
Si₃N₄ AMB and AlN/Al₂O₃ DBC substrates for SiC power modules exposed to high current, thermal cycling and long-term reliability requirements.
Recommended:
Si₃N₄ · AMB / DBC
RF & Microwave Packaging
Ceramic substrates for RF and microwave packages requiring dimensional stability, reliable metallization and controlled electrical performance in high-frequency environments.
Recommended:
AlN / Al₂O₃ · DPC
UV LED Modules
AlN and Al₂O₃ ceramic substrates for UV LED modules requiring thermal control, electrical insulation and stable package performance under continuous operation.
Recommended:
AlN / Al₂O₃ · DPC
Material & Process Selection
Select ceramic materials and metallization processes based on thermal conductivity, copper thickness, circuit density and reliability requirements.
Materials
AlN
Recommended for high-power laser, RF and optoelectronic packages requiring high thermal conductivity and electrical insulation.
Si3N4
Recommended for SiC power modules and high-reliability applications requiring mechanical strength and thermal cycling performance.
Al₂O₃
Recommended for cost-sensitive ceramic substrate applications requiring stable insulation and mature metallization processes.
Technologies
DPC
Suitable for fine-line ceramic circuits, laser packaging, sensors, TEC modules and high-density layouts.
DBC
Suitable for power modules and high-current ceramic substrates requiring thicker copper, thermal spreading and stable insulation.
AMB
Suitable for high-reliability power modules, especially Si₃N₄-based substrates used in demanding thermal cycling environments.
Process Capability Snapshot
A practical overview of supported materials, process options and manufacturability ranges for advanced ceramic substrate projects.
Supported Materials & Processes
Al₂O₃, AlN and Si₃N₄ ceramic substrates supported depending on thermal, electrical and reliability requirements.
Process Options
DPC, DBC and AMB process routes available for different circuit density, copper thickness and reliability needs.
Typical Project Support
Prototype builds, NPI review, material selection and manufacturability feedback before quotation.
Manufacturing Capability
Substrate Size
Line / Space
Copper Thickness
Hole / Via Capability
Surface Finishes
Standard formats up to 138 × 190 mm; special projects up to 400 × 500 mm
Standard capability from 0.10 mm; special DPC designs down to 0.03 mm, subject to drawing review
5–800 μm depending on DPC, DBC or AMB process route
Metallized holes and ceramic drilling available; minimum hole size depends on substrate thickness and process
ENIG, immersion silver, gold plating, silver plating, OSP and tin finishes available by requirement
Support for ceramic substrate projects from early design review to prototype builds and production transfer.
Why Engineering Teams Work With Vexera
Application-Focused Review
Prototype & NPI Support
Material & Process Guidance
Discuss Your Ceramic Substrate Project
Share your application requirements, drawings, stack-up or thermal design challenges with our engineering team.
Engineering Review
Share your drawing, stack-up or application requirements for manufacturability feedback before quotation.
Prototype Support
Discuss prototype builds, material selection, DPC / DBC / AMB process route and early-stage NPI requirements.
RFQ Preparation
Send your substrate requirements so our team can prepare a focused technical quotation.